Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431371 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-08-30 |
| 9293393 | Stacked packaging using reconstituted wafers | Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Sampath K. V. Karikalan, Xiangdong Chen | 2016-03-22 |
| 9275976 | System-in-package with integrated socket | Sam Ziqun Zhao, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-03-01 |