Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472485 | Hybrid thermal interface material for IC packages with integrated heat spreader | Mehdi Saeidi | 2016-10-18 |
| 9459921 | Creating a system on the fly and applications thereof | Ahmadreza (Reza) Rofougaran, Arya Behzad, Michael Boers, Jesus Alfonso Castaneda | 2016-10-04 |
| 9431371 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-08-30 |
| 9431370 | Compliant dielectric layer for semiconductor device | Rezaur Rahman Khan | 2016-08-30 |
| 9406636 | Interposer package-on-package structure | Rezaur Rahman Khan | 2016-08-02 |
| 9406793 | Semiconductor device with a vertical channel formed through a plurality of semiconductor layers | Frank Hui | 2016-08-02 |
| 9390993 | Semiconductor border protection sealant | Galen Kirkpatrick, Edward Law, Reza-ur Rahman Khan, Ming Wang Sze | 2016-07-12 |
| 9318785 | Apparatus for reconfiguring an integrated waveguide | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2016-04-19 |
| 9299634 | Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages | Rezaur Rahman Khan | 2016-03-29 |
| 9293393 | Stacked packaging using reconstituted wafers | Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Sampath K. V. Karikalan, Xiangdong Chen | 2016-03-22 |
| 9286121 | Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2016-03-15 |
| 9275976 | System-in-package with integrated socket | Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-03-01 |
| 9230875 | Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding | Rezaur Rahman Khan | 2016-01-05 |