Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080866 | 3-D integrated semiconductor device comprising intermediate heat spreading capabilities | Michael Grillberger, Frank Feustel | 2011-12-20 |
| 8048811 | Method for patterning a metallization layer by reducing resist strip induced damage of the dielectric material | Frank Feustel, Juergen Boemmels | 2011-11-01 |
| 8048796 | Microstructure device including a metallization structure with self-aligned air gaps formed based on a sacrificial material | Robert Seidel | 2011-11-01 |
| 8048736 | Semiconductor device comprising a capacitor in the metallization system and a method of forming the capacitor | Frank Feustel, Kai Frohberg | 2011-11-01 |
| 8040497 | Method and test structure for estimating focus settings in a lithography process based on CD measurements | Frank Feustel, Kai Frohberg | 2011-10-18 |
| 8030209 | Enhancing structural integrity of low-k dielectrics in metallization systems of semiconductor devices by using a crack suppressing material layer | Kai Frohberg, Frank Feustel | 2011-10-04 |
| 7989352 | Technique for reducing plasma-induced etch damage during the formation of vias in interlayer dielectrics | Frank Feustel, Kai Frohberg | 2011-08-02 |
| 7977237 | Fabricating vias of different size of a semiconductor device by splitting the via patterning process | Frank Feustel, Kai Frohberg | 2011-07-12 |
| 7955962 | Method of reducing contamination by providing a removable polymer protection film during microstructure processing | Ralf Richter, Frank Feustel, Kai Frohberg | 2011-06-07 |
| 7951677 | Corner rounding in a replacement gate approach based on a sacrificial fill material applied prior to work function metal deposition | Jens Heinrich, Frank Seliger, Frank Richter | 2011-05-31 |
| 7932166 | Field effect transistor having a stressed contact etch stop layer with reduced conformality | Kai Frohberg, Frank Feustel | 2011-04-26 |
| 7902581 | Semiconductor device comprising a contact structure based on copper and tungsten | Kai Frohberg, Carsten Peters | 2011-03-08 |
| 7871941 | Method for reducing resist poisoning during patterning of stressed nitrogen-containing layers in a semiconductor device | Kai Frohberg, Ralf Richter | 2011-01-18 |