Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080866 | 3-D integrated semiconductor device comprising intermediate heat spreading capabilities | Thomas Werner, Frank Feustel | 2011-12-20 |
| 7982313 | Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability | Matthias Lehr | 2011-07-19 |