Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053354 | Reduced wafer warpage in semiconductors by stress engineering in the metallization system | Matthias Lehr, Frank Koschinsky | 2011-11-08 |
| 8034726 | Interlayer dielectric material in a semiconductor device comprising a doublet structure of stressed materials | Ralf Richter, Michael Finken, Heike Salz | 2011-10-11 |
| 7994059 | Enhanced stress transfer in an interlayer dielectric by using an additional stress layer above a dual stress liner in a semiconductor device | Ralf Richter, Martin Gerhardt, Martin Mazur | 2011-08-09 |
| 7994072 | Stress transfer by sequentially providing a highly stressed etch stop material and an interlayer dielectric in a contact layer stack of a semiconductor device | Michael Finken, Ralf Richter | 2011-08-09 |
| 7938973 | Arc layer having a reduced flaking tendency and a method of manufacturing the same | Ralf Richter, Martin Mazur | 2011-05-10 |
| 7906383 | Stress transfer in an interlayer dielectric by providing a stressed dielectric layer above a stress-neutral dielectric material in a semiconductor device | Ralf Richter, Andy Wei, Manfred Horstmann | 2011-03-15 |
| 7875561 | Interlayer dielectric material in a semiconductor device comprising stressed layers with an intermediate buffer material | Michael Finken, Ralf Richter | 2011-01-25 |
| 7867917 | Etch stop layer for a metallization layer with enhanced adhesion, etch selectivity and hermeticity | Matthias Lehr, Volker Kahlert | 2011-01-11 |