Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084354 | Method of fabricating a metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices | Christof Streck | 2011-12-27 |
| 7867917 | Etch stop layer for a metallization layer with enhanced adhesion, etch selectivity and hermeticity | Joerg Hohage, Matthias Lehr | 2011-01-11 |