Issued Patents 2005
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974769 | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization | Homayoun Talieh, Cyprian Emeka Uzoh | 2005-12-13 |
| 6967166 | Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing | Jeffrey Bogart, Efrain Velazquez | 2005-11-22 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate | Homayoun Talieh | 2005-10-25 |
| 6946066 | Multi step electrodeposition process for reducing defects and minimizing film thickness | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-09-20 |
| 6943112 | Defect-free thin and planar film processing | Cyprian Emeka Uzoh | 2005-09-13 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-09-13 |
| 6939206 | Method and apparatus of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Homayoun Talieh, Konstantin Volodarsky | 2005-09-06 |
| 6936154 | Planarity detection methods and apparatus for electrochemical mechanical processing systems | Cyprian Emeka Uzoh | 2005-08-30 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-08-23 |
| 6921551 | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece | — | 2005-07-26 |
| 6908374 | Chemical mechanical polishing endpoint detection | Yuchun Wang, Bernard Frey, Douglas W. Young, Homayoun Talieh, Efrain Velazquez | 2005-06-21 |
| 6905588 | Packaging deposition methods | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-06-14 |
| 6867136 | Method for electrochemically processing a workpiece | Homayoun Talieh, Cyprian Emeka Uzoh | 2005-03-15 |
| 6866763 | Method and system monitoring and controlling film thickness profile during plating and electroetching | Cyprian Emeka Uzoh | 2005-03-15 |
| 6861354 | Method and structure to reduce defects in integrated circuits and substrates | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-03-01 |
| 6857947 | Advanced chemical mechanical polishing system with smart endpoint detection | Yuchun Wang, Bernard Frey, Homayoun Talieh, Douglas W. Young, Brett E. McGrath +3 more | 2005-02-22 |
| 6858121 | Method and apparatus for filling low aspect ratio cavities with conductive material at high rate | — | 2005-02-22 |
| 6855037 | Method of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Homayoun Talieh, Konstantin Volodarsky | 2005-02-15 |
| 6852630 | Electroetching process and system | Cyprian Emeka Uzoh, Halit Yakupoglu, Homayoun Talieh | 2005-02-08 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer | Jalal Ashjaee, Boguslaw Nagorski, Homayoun Talieh, Cyprian Emeka Uzoh | 2005-02-08 |