Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953392 | Integrated system for processing semiconductor wafers | Homayoun Talieh | 2005-10-11 |
| 6939206 | Method and apparatus of sealing wafer backside for full-face electrochemical plating | Homayoun Talieh, Bulent M. Basol, Konstantin Volodarsky | 2005-09-06 |
| 6932679 | Apparatus and method for loading a wafer in polishing system | Homayoun Talieh, Konstantin Volodarsky, Douglas W. Young | 2005-08-23 |
| 6855037 | Method of sealing wafer backside for full-face electrochemical plating | Homayoun Talieh, Bulent M. Basol, Konstantin Volodarsky | 2005-02-15 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer | Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Emeka Uzoh | 2005-02-08 |