CU

Cyprian Emeka Uzoh

AN Asm Nutool: 11 patents #3 of 18Top 20%
NU Nutool: 3 patents #3 of 9Top 35%
IBM: 2 patents #845 of 5,214Top 20%
📍 San Jose, CA: #4 of 2,758 inventorsTop 1%
🗺 California: #39 of 26,868 inventorsTop 1%
Overall (2005): #247 of 245,428Top 1%
17
Patents 2005

Issued Patents 2005

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
6979393 Method for plating copper conductors and devices formed Kenneth P. Rodbell, Panayotis Andricacos, Cyril Cabral, Jr., Lynne M. Gignac, Peter S. Locke 2005-12-27
6974769 Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization Bulent M. Basol, Homayoun Talieh 2005-12-13
6969456 Method of using vertically configured chamber used for multiple processes Konstantin Volodarsky, Boguslaw Nagorski, Rimma Volodarsky, Douglas W. Young, Homayoun Talieh 2005-11-29
6946066 Multi step electrodeposition process for reducing defects and minimizing film thickness Bulent M. Basol, Homayoun Talieh 2005-09-20
6946716 Electroplated interconnection structures on integrated circuit chips Panayotis Andricacos, Harikilia Deligianni, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans +4 more 2005-09-20
6942780 Method and apparatus for processing a substrate with minimal edge exclusion Bulent M. Basol, Homayoun Talieh 2005-09-13
6943112 Defect-free thin and planar film processing Bulent M. Basol 2005-09-13
6936154 Planarity detection methods and apparatus for electrochemical mechanical processing systems Bulent M. Basol 2005-08-30
6932896 Method and apparatus for avoiding particle accumulation in electrodeposition Bulent M. Basol, Homayoun Talieh 2005-08-23
6905588 Packaging deposition methods Homayoun Talieh, Bulent M. Basol 2005-06-14
6884334 Vertically configured chamber used for multiple processes Konstantin Volodarsky, Boguslaw A. Nigorski, Rimma Volodarsky, Douglas W. Young, Homayoun Talieh 2005-04-26
6867136 Method for electrochemically processing a workpiece Bulent M. Basol, Homayoun Talieh 2005-03-15
6866763 Method and system monitoring and controlling film thickness profile during plating and electroetching Bulent M. Basol 2005-03-15
6861354 Method and structure to reduce defects in integrated circuits and substrates Homayoun Talieh, Bulent M. Basol 2005-03-01
6852208 Method and apparatus for full surface electrotreating of a wafer Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh 2005-02-08
6852630 Electroetching process and system Bulent M. Basol, Halit Yakupoglu, Homayoun Talieh 2005-02-08
6837979 Method and apparatus for depositing and controlling the texture of a thin film Homayoun Talieh 2005-01-04