Issued Patents 2005
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974769 | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-12-13 |
| 6969456 | Method of using vertically configured chamber used for multiple processes | Konstantin Volodarsky, Boguslaw Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Emeka Uzoh | 2005-11-29 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate | Bulent M. Basol | 2005-10-25 |
| 6953392 | Integrated system for processing semiconductor wafers | Jalal Ashjaee | 2005-10-11 |
| 6951507 | Substrate polishing apparatus | — | 2005-10-04 |
| 6946066 | Multi step electrodeposition process for reducing defects and minimizing film thickness | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-09-20 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-09-13 |
| 6939206 | Method and apparatus of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Bulent M. Basol, Konstantin Volodarsky | 2005-09-06 |
| 6939203 | Fluid bearing slide assembly for workpiece polishing | Douglas W. Young | 2005-09-06 |
| 6932679 | Apparatus and method for loading a wafer in polishing system | Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young | 2005-08-23 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-08-23 |
| 6908374 | Chemical mechanical polishing endpoint detection | Yuchun Wang, Bernard Frey, Bulent M. Basol, Douglas W. Young, Efrain Velazquez | 2005-06-21 |
| 6905588 | Packaging deposition methods | Cyprian Emeka Uzoh, Bulent M. Basol | 2005-06-14 |
| 6902659 | Method and apparatus for electro-chemical mechanical deposition | — | 2005-06-07 |
| 6884334 | Vertically configured chamber used for multiple processes | Konstantin Volodarsky, Boguslaw A. Nigorski, Rimma Volodarsky, Douglas W. Young, Cyprian Emeka Uzoh | 2005-04-26 |
| 6867136 | Method for electrochemically processing a workpiece | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-03-15 |
| 6861354 | Method and structure to reduce defects in integrated circuits and substrates | Cyprian Emeka Uzoh, Bulent M. Basol | 2005-03-01 |
| 6857947 | Advanced chemical mechanical polishing system with smart endpoint detection | Yuchun Wang, Bernard Frey, Bulent M. Basol, Douglas W. Young, Brett E. McGrath +3 more | 2005-02-22 |
| 6855037 | Method of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Bulent M. Basol, Konstantin Volodarsky | 2005-02-15 |
| 6852630 | Electroetching process and system | Bulent M. Basol, Cyprian Emeka Uzoh, Halit Yakupoglu | 2005-02-08 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer | Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Cyprian Emeka Uzoh | 2005-02-08 |
| 6837979 | Method and apparatus for depositing and controlling the texture of a thin film | Cyprian Emeka Uzoh | 2005-01-04 |