Issued Patents 2005
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979598 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2005-12-27 |
| 6979889 | Plastic lead frames for semiconductor devices | Jerrold L. King | 2005-12-27 |
| 6972200 | Method for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2005-12-06 |
| 6969914 | Electronic device package | Jason L. Fuller, Frank Hall | 2005-11-29 |
| 6967164 | Method for electroless plating a contact pad | Li Li | 2005-11-22 |
| 6967113 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2005-11-22 |
| 6962826 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2005-11-08 |
| 6953700 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2005-10-11 |
| 6954081 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2005-10-11 |
| 6953699 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2005-10-11 |
| 6949834 | Stacked semiconductor package with circuit side polymer layer | Mike Connell | 2005-09-27 |
| 6949943 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2005-09-27 |
| 6936775 | Selectively configurable circuit board | David Y. Kao | 2005-08-30 |
| 6933221 | Method for underfilling semiconductor components using no flow underfill | — | 2005-08-23 |
| 6926190 | Integrated circuit assemblies and assembly methods | Tsuyoshi Yamashita | 2005-08-09 |
| 6906415 | Semiconductor device assemblies and packages including multiple semiconductor devices and methods | Setho Sing Fee, Tay Wuu Yean, Lim Thiam Chye | 2005-06-14 |
| 6906417 | Ball grid array utilizing solder balls having a core material covered by a metal layer | Salman Akram | 2005-06-14 |
| 6902956 | Method and structure for manufacturing improved yield semiconductor packaged devices | — | 2005-06-07 |
| 6900080 | Microelectronic package with reduced underfill and methods for forming such packages | Farrah J. Storli | 2005-05-31 |
| 6896760 | Fabrication of stacked microelectronic devices | Michael Connell | 2005-05-24 |
| 6893952 | Methods of forming a ball grid array including a non-conductive polymer core and a silver or silver alloy outer layer | Salman Akram | 2005-05-17 |
| 6894380 | Packaged stacked semiconductor die and method of preparing same | Michael Connell | 2005-05-17 |
| 6889430 | Method of selectively adjusting surface tension of soldermask material | Partrick Tandy | 2005-05-10 |
| 6891108 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2005-05-10 |
| 6890384 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2005-05-10 |