Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6900080 | Microelectronic package with reduced underfill and methods for forming such packages | Tongbi Jiang | 2005-05-31 |
| 6885101 | Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods | — | 2005-04-26 |
| 6844618 | Microelectronic package with reduced underfill and methods for forming such packages | Tongbi Jiang | 2005-01-18 |