Issued Patents 2005
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979598 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Syed Sajid Ahmad | 2005-12-27 |
| 6974725 | Interconnections for a semiconductor device | Larry D. Kinsman, Warren M. Farnworth | 2005-12-13 |
| 6970359 | Reduced-sized memory card package, length-extending adaptor and method of forming adaptor | Derek Gochnour, Michael W. Morrison | 2005-11-29 |
| 6969632 | Method for fabricating image sensor semiconductor package | — | 2005-11-29 |
| 6963128 | Vertically mountable and alignable semiconductor device assembly | Larry D. Kinsman, Warren M. Farnworth | 2005-11-08 |
| 6917090 | Chip scale image sensor package | — | 2005-07-12 |
| 6903465 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Larry D. Kinsman | 2005-06-07 |
| 6894521 | Burn-in carrier for a semiconductor die | John O. Jacobson | 2005-05-17 |
| 6890384 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Syed Sajid Ahmad, Gregory M. Chapman, Tongbi Jiang | 2005-05-10 |
| 6876562 | Apparatus and method for mounting microelectronic devices on a mirrored board assembly | Chris G. Martin, Brent Keeth, Brian Johnson | 2005-04-05 |
| 6865086 | Apparatus and method to secure an adaptor to a reduced-sized memory card | Derek Gochnour, Michael W. Morrison | 2005-03-08 |
| 6861290 | Flip-chip adaptor package for bare die | — | 2005-03-01 |
| 6858926 | Stackable ceramic FBGA for high thermal applications | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2005-02-22 |
| 6858467 | Method for fabricating semiconductor packages with stacked dice and leadframes | — | 2005-02-22 |
| 6838768 | Module assembly for stacked BGA packages | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2005-01-04 |