Issued Patents 2005
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979902 | Chip size image sensor camera module | — | 2005-12-27 |
| 6979596 | Method of fabricating a tape having apertures under a lead frame for conventional IC packages | David J. Corisis, Jerry M. Brooks | 2005-12-27 |
| 6974725 | Interconnections for a semiconductor device | Walter L. Moden, Warren M. Farnworth | 2005-12-13 |
| 6964886 | Methods of fabrication for flip-chip image sensor packages | — | 2005-11-15 |
| 6963128 | Vertically mountable and alignable semiconductor device assembly | Walter L. Moden, Warren M. Farnworth | 2005-11-08 |
| 6956295 | Flip-chip image sensor packages | — | 2005-10-18 |
| 6940141 | Flip-chip image sensor packages and methods of fabrication | — | 2005-09-06 |
| 6934065 | Microelectronic devices and methods for packaging microelectronic devices | — | 2005-08-23 |
| 6921966 | Tape under frame for lead frame IC package assembly | David J. Corisis, Jerry M. Brooks | 2005-07-26 |
| 6911737 | Semiconductor device package and method | Alan G. Wood | 2005-06-28 |
| 6906424 | Semiconductor package and method producing same | — | 2005-06-14 |
| 6903465 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Walter L. Moden | 2005-06-07 |
| 6900079 | Method for fabricating a chip scale package using wafer level processing | Salman Akram | 2005-05-31 |
| 6894372 | Tape under frame for lead frame IC package assembly | David J. Corisis, Jerry M. Brooks | 2005-05-17 |
| 6885107 | Flip-chip image sensor packages and methods of fabrication | — | 2005-04-26 |
| 6873037 | Vertical surface mount package utilizing a back-to-back semiconductor device module | — | 2005-03-29 |
| 6858926 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2005-02-22 |
| 6838768 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2005-01-04 |