Issued Patents 2005
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6980014 | Interposer and methods for fabricating same | Salman Akram, Warren M. Farnworth | 2005-12-27 |
| 6979898 | Semiconductor component and a method of fabricating the semiconductor component | Warren M. Farnworth | 2005-12-27 |
| 6975037 | Semiconductor package having flex circuit with external contacts | Warren M. Farnworth, Mike Brooks | 2005-12-13 |
| 6975030 | Silicon carbide contact for semiconductor components | Salman Akram | 2005-12-13 |
| 6964915 | Method of fabricating encapsulated semiconductor components by etching | Warren M. Farnworth, Trung T. Doan | 2005-11-15 |
| 6953995 | Hermetic chip in wafer form | Warren M. Farnworth, Salman Akram | 2005-10-11 |
| 6952054 | Semiconductor package having interconnect with conductive members | Salman Akram, Warren M. Farnworth | 2005-10-04 |
| 6952744 | Computer including optical interconnect, memory unit, and method of assembling a computer | Warren M. Farnworth | 2005-10-04 |
| 6914198 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, J. Michael Brooks, Eugene H. Cloud | 2005-07-05 |
| 6911737 | Semiconductor device package and method | Larry D. Kinsman | 2005-06-28 |
| 6911355 | Semiconductor package having flex circuit with external contacts | Warren M. Farnworth, Mike Brooks | 2005-06-28 |
| 6908784 | Method for fabricating encapsulated semiconductor components | Warren M. Farnworth, Trung T. Doan | 2005-06-21 |
| 6909055 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, J. Michael Brooks, Eugene H. Cloud | 2005-06-21 |
| 6909194 | Electronic assembly having semiconductor component with polymer support member and method of fabrication | Warren M. Farnworth | 2005-06-21 |
| 6903443 | Semiconductor component and interconnect having conductive members and contacts on opposing sides | Warren M. Farnworth, David R. Hembree | 2005-06-07 |
| 6903442 | Semiconductor component having backside pin contacts | Trung T. Doan | 2005-06-07 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2005-05-31 |
| 6881974 | Probe card for testing microelectronic components | Trung T. Doan, David R. Hembree | 2005-04-19 |
| 6875640 | Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed | Warren M. Farnworth | 2005-04-05 |
| 6876089 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2005-04-05 |
| 6873046 | Chip-scale package and carrier for use therewith | Salman Akram | 2005-03-29 |
| 6861745 | Method and apparatus for conducting heat in a flip-chip assembly | Salman Akram | 2005-03-01 |
| 6857183 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames | Warren M. Farnworth | 2005-02-22 |
| 6851597 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth | 2005-02-08 |
| 6847110 | Method and apparatus for conducting heat in a flip-chip assembly | Salman Akram | 2005-01-25 |