Issued Patents 2005
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967307 | Method and process of contact to a heat softened solder ball array | Warren M. Farnworth | 2005-11-22 |
| 6967497 | Wafer processing apparatuses and electronic device workpiece processing apparatuses | — | 2005-11-22 |
| 6954000 | Semiconductor component with redistribution circuit having conductors and test contacts | Jorge L. de Varona | 2005-10-11 |
| 6939145 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | Salman Akram, Derek Gochnour | 2005-09-06 |
| 6933524 | Semiconductor component having test contacts | Jorge L. de Varona | 2005-08-23 |
| 6932077 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus | Salman Akram, Derek Gochnour, Michael E. Hess | 2005-08-23 |
| 6903443 | Semiconductor component and interconnect having conductive members and contacts on opposing sides | Warren M. Farnworth, Alan G. Wood | 2005-06-07 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, James M. Wark, Jennifer L. Folaron +3 more | 2005-05-31 |
| 6899797 | Apparatus for continuous processing of semiconductor wafers | Salman Akram | 2005-05-31 |
| 6897571 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2005-05-24 |
| 6881974 | Probe card for testing microelectronic components | Alan G. Wood, Trung T. Doan | 2005-04-19 |
| 6881274 | Carrier for cleaning sockets for semiconductor components having contact balls | — | 2005-04-19 |
| 6851597 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2005-02-08 |
| 6850084 | Assembly for testing silicon wafers which have a through-via | — | 2005-02-01 |
| 6841868 | Memory modules including capacity for additional memory | Salman Akram, James M. Wark | 2005-01-11 |
| 6841883 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, Kyle K. Kirby +1 more | 2005-01-11 |