Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943106 | Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling | Shuang Meng, Garo Derderian | 2005-09-13 |
| 6924655 | Probe card for use with microelectronic components, and methods for making same | — | 2005-08-02 |
| 6922297 | Double-attribute method of encoding and decoding magnetic data | — | 2005-07-26 |
| 6855631 | Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials | — | 2005-02-15 |
| 6841883 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more | 2005-01-11 |