Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927589 | Apparatus for testing bumped die | — | 2005-08-09 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 2005-05-31 |
| 6869826 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2005-03-22 |
| 6853069 | Packaged die on PCB with heat sink encapsulant and methods | Salman Akram | 2005-02-08 |
| 6841868 | Memory modules including capacity for additional memory | Salman Akram, David R. Hembree | 2005-01-11 |
| 6841883 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more | 2005-01-11 |