Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6932077 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus | Salman Akram, Derek Gochnour, David R. Hembree | 2005-08-23 |
| 6897571 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2005-05-24 |
| 6851597 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2005-02-08 |