Issued Patents 2005
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979596 | Method of fabricating a tape having apertures under a lead frame for conventional IC packages | Larry D. Kinsman, Jerry M. Brooks | 2005-12-27 |
| 6977214 | Die paddle clamping method for wire bond enhancement | — | 2005-12-20 |
| 6958528 | Leads under chip IC package | — | 2005-10-25 |
| 6949821 | Semiconductor package | — | 2005-09-27 |
| 6946722 | Multi-part lead frame with dissimilar materials | S. Hinkle, Jerry M. Brooks | 2005-09-20 |
| 6939739 | Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit | — | 2005-09-06 |
| 6924550 | Packaged microelectronic devices and methods for assembling microelectronic devices | Mike Brooks | 2005-08-02 |
| 6920688 | Method for a semiconductor assembly having a semiconductor die with dual heat spreaders | — | 2005-07-26 |
| 6921966 | Tape under frame for lead frame IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2005-07-26 |
| 6914275 | Semiconductor component with electrical characteristic adjustment circuitry | Aaron Schoenfeld, Tyler Gomm | 2005-07-05 |
| 6902952 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, Jerry M. Brooks | 2005-06-07 |
| 6903464 | Semiconductor die package | — | 2005-06-07 |
| 6900528 | Stacked mass storage flash memory package | Leonard E. Mess, Jerry M. Brooks | 2005-05-31 |
| 6894372 | Tape under frame for lead frame IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2005-05-17 |
| 6882034 | Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2005-04-19 |
| 6879050 | Packaged microelectronic devices and methods for packaging microelectronic devices | Blaine J. Thurgood | 2005-04-12 |
| 6867500 | Multi-chip module and methods | Jerry M. Brooks, Matt E. Schwab | 2005-03-15 |
| 6858453 | Integrated circuit package alignment feature | Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill | 2005-02-22 |
| 6858926 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2005-02-22 |
| 6856013 | Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit | — | 2005-02-15 |
| 6847100 | High speed IC package configuration | Brent Keeth | 2005-01-25 |
| 6837731 | Locking assembly for securing a semiconductor device to a carrier substrate | Jerry M. Brooks, Terry R. Lee | 2005-01-04 |
| 6838768 | Module assembly for stacked BGA packages | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2005-01-04 |