Issued Patents 2005
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6885108 | Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein | Shijian Luo, S. Hinkle | 2005-04-26 |
| 6881606 | Method for forming a protective layer for use in packaging a semiconductor die | Zhiping Yin, Mike Connell | 2005-04-19 |
| 6872600 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2005-03-29 |
| 6864153 | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another | W. Jeff Reeder | 2005-03-08 |
| 6858927 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2005-02-22 |
| 6844052 | Method for underfilling semiconductor components | — | 2005-01-18 |
| 6844618 | Microelectronic package with reduced underfill and methods for forming such packages | Farrah J. Storli | 2005-01-18 |
| 6841422 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2005-01-11 |