Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949834 | Stacked semiconductor package with circuit side polymer layer | Tongbi Jiang | 2005-09-27 |
| 6881606 | Method for forming a protective layer for use in packaging a semiconductor die | Tongbi Jiang, Zhiping Yin | 2005-04-19 |