Issued Patents 2005
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972200 | Method for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-12-06 |
| 6967113 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-11-22 |
| 6962826 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-11-08 |
| 6953700 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-10-11 |
| 6953699 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-10-11 |
| 6954081 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-10-11 |
| 6949943 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2005-09-27 |
| 6916683 | Methods of fabricating a molded ball grid array | William R. Stephenson, Todd O. Bolken | 2005-07-12 |
| 6891108 | Semiconductor packages and methods for making the same | Casey Prindiville, Tongbi Jiang | 2005-05-10 |
| 6858927 | Semiconductor packages and methods for making the same | Casey Prindiville, Tongbi Jiang | 2005-02-22 |