Issued Patents 2005
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6963142 | Flip chip integrated package mount support | — | 2005-11-08 |
| 6955941 | Methods and apparatus for packaging semiconductor devices | — | 2005-10-18 |
| 6953891 | Moisture-resistant electronic device package and methods of assembly | Cary J. Baerlocher, Steven W. Heppler, Chad A. Cobbley | 2005-10-11 |
| 6951981 | Asymmetric transfer molding method and an asymmetric encapsulation made therefrom | Mark S. Johnson | 2005-10-04 |
| 6939746 | Method for assembling semiconductor die packages with standard ball grid array footprint | — | 2005-09-06 |
| 6916683 | Methods of fabricating a molded ball grid array | William R. Stephenson, Bret K. Street | 2005-07-12 |
| 6910874 | Apparatus for encapsulating a multi-chip substrate array | David L. Peters | 2005-06-28 |
| 6906403 | Sealed electronic device packages with transparent coverings | Chad A. Cobbley | 2005-06-14 |
| 6856009 | Techniques for packaging multiple device components | Chad A. Cobbley | 2005-02-15 |
| 6853064 | Semiconductor component having stacked, encapsulated dice | Chad A. Cobbley | 2005-02-08 |
| 6841424 | Semiconductor assembly encapsulation mold and method for forming same | — | 2005-01-11 |