SH

Steven W. Heppler

Micron: 1 patents #434 of 861Top 55%
📍 Boise, ID: #251 of 564 inventorsTop 45%
🗺 Idaho: #384 of 1,002 inventorsTop 40%
Overall (2005): #98,322 of 245,428Top 45%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6953891 Moisture-resistant electronic device package and methods of assembly Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley 2005-10-11