Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6864153 | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another | Tongbi Jiang | 2005-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6864153 | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another | Tongbi Jiang | 2005-03-08 |