Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951777 | Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate | Setho Sing Fee, Lim Thiam Chye | 2005-10-04 |
| 6946325 | Methods for packaging microelectronic devices | Victor Tan Cher Khng | 2005-09-20 |
| 6913476 | Temporary, conformable contacts for microelectronic components | Lee Choon Kuan | 2005-07-05 |
| 6906415 | Semiconductor device assemblies and packages including multiple semiconductor devices and methods | Tongbi Jiang, Setho Sing Fee, Lim Thiam Chye | 2005-06-14 |
| 6870247 | Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled | Setho Sing Fee, Lim Thiam Chye | 2005-03-22 |