Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972214 | Method for fabricating a semiconductor package with multi layered leadframe | Chong Chin Hui, Lee Wang Lai | 2005-12-06 |
| 6913476 | Temporary, conformable contacts for microelectronic components | Tay Wuu Yean | 2005-07-05 |
| 6903449 | Semiconductor component having chip on board leadframe | Dalson Ye Seng Kim, Jeffrey Toh Tuck Fook | 2005-06-07 |