Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972214 | Method for fabricating a semiconductor package with multi layered leadframe | Lee Choon Kuan, Chong Chin Hui | 2005-12-06 |
LL
Lee Wang Lai
Overall (2005): #151,973 of 245,428Top 65%
1
Patents 2005