Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972214 | Method for fabricating a semiconductor package with multi layered leadframe | Lee Choon Kuan, Lee Wang Lai | 2005-12-06 |
CH
Chong Chin Hui
Overall (2005): #224,775 of 245,428Top 95%
1
Patents 2005