Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903449 | Semiconductor component having chip on board leadframe | Dalson Ye Seng Kim, Lee Choon Kuan | 2005-06-07 |
| 6847220 | Method for ball grid array chip packages having improved testing and stacking characteristics | Wuu Yean Tay | 2005-01-25 |