Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977435 | Thick metal layer integrated process flow to improve power delivery and mechanical buffering | Sarah Kim, Bob Martell, Dave Ayers, R. Scott List, Steven Towle | 2005-12-20 |
| 6943121 | Selectively converted inter-layer dielectric | Jihperng Leu, Grant Kloster, David H. Gracias, Lee Rockford, Chris Barns | 2005-09-13 |
| 6908829 | Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines | Makarem A. Hussein, Jim Powers, Kevin P. O'Brien | 2005-06-21 |
| 6900063 | Methods and apparatuses for producing a polymer memory device | Makarem A. Hussein, Ebrahim Andideh, Daniel Diana | 2005-05-31 |
| 6878465 | Under bump metallurgy for Lead-Tin bump over copper pad | Zhiyong Ma, Madhav Datta | 2005-04-12 |