Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977224 | Method of electroless introduction of interconnect structures | Valery M. Dubin, Christopher D. Thomas, Paul McGregor | 2005-12-20 |
| 6917106 | Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps | — | 2005-07-12 |
| 6878465 | Under bump metallurgy for Lead-Tin bump over copper pad | Peter K. Moon, Zhiyong Ma | 2005-04-12 |
| 6853076 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same | Dave Emory, Subhash M. Joshi, Susanne Menezes, Doowon Suh | 2005-02-08 |