Issued Patents 2005
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977224 | Method of electroless introduction of interconnect structures | Christopher D. Thomas, Paul McGregor, Madhav Datta | 2005-12-20 |
| 6958547 | Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs | Chin-Chang Cheng, Makarem A. Hussein, Phi L. Nguyen, Ruth A. Brain | 2005-10-25 |
| 6933171 | Large bumps for optical flip chips | Ming Fang, Daoqiang Lu | 2005-08-23 |
| 6933222 | Microcircuit fabrication and interconnection | Mark Bohr | 2005-08-23 |
| 6933230 | Method for making interconnects and diffusion barriers in integrated circuits | — | 2005-08-23 |
| 6921684 | Method of sorting carbon nanotubes including protecting metallic nanotubes and removing the semiconducting nanotubes | — | 2005-07-26 |
| 6908504 | Electroless plating bath composition and method of using | Ramanan V. Chebiam | 2005-06-21 |
| 6893550 | Electroplating bath composition and method of using | Kimin Hong, Nate Baxter | 2005-05-17 |
| 6843852 | Apparatus and method for electroless spray deposition | Vincent Caillouette, Christopher D. Thomas, Chin-Chang Cheng | 2005-01-18 |
| 6841458 | Dopant interface formation | Jacob M. Faber | 2005-01-11 |