CC

Chin-Chang Cheng

IN Intel: 3 patents #221 of 2,371Top 10%
📍 Taipei, OR: #1 of 3 inventorsTop 35%
Overall (2005): #26,026 of 245,428Top 15%
3
Patents 2005

Issued Patents 2005

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6958547 Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs Valery M. Dubin, Makarem A. Hussein, Phi L. Nguyen, Ruth A. Brain 2005-10-25
6919231 Methods of forming channels on an integrated circuit die and die cooling systems including such channels Shriram Ramanathan, Alan M. Myers 2005-07-19
6843852 Apparatus and method for electroless spray deposition Valery M. Dubin, Vincent Caillouette, Christopher D. Thomas 2005-01-18