Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958547 | Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs | Valery M. Dubin, Chin-Chang Cheng, Makarem A. Hussein, Phi L. Nguyen | 2005-10-25 |