Issued Patents 2005
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964919 | Low-k dielectric film with good mechanical strength | Lee Rockford, Jihperng Leu | 2005-11-15 |
| 6946384 | Stacked device underfill and a method of fabrication | Michael Goodner, Shriram Ramanathan, Patrick Morrow | 2005-09-20 |
| 6943121 | Selectively converted inter-layer dielectric | Jihperng Leu, David H. Gracias, Lee Rockford, Peter K. Moon, Chris Barns | 2005-09-13 |
| 6930391 | Method for alloy-electroplating group IB metals with refractory metals for interconnections | Sean J. Hearne | 2005-08-16 |
| 6905958 | Protecting metal conductors with sacrificial organic monolayers | David H. Gracias | 2005-06-14 |
| 6903461 | Semiconductor device having a region of a material which is vaporized upon exposing to ultraviolet radiation | Jihperng Leu, Hyun-Mog Park | 2005-06-07 |
| 6867473 | Plating a conductive material on a dielectric material | Michael Goodner, Steven W. Johnston | 2005-03-15 |
| 6867125 | Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material | Jihperng Leu, Hyun-Mog Park | 2005-03-15 |
| 6861332 | Air gap interconnect method | Hyun-Mog Park | 2005-03-01 |
| 6846755 | Bonding a metal component to a low-k dielectric material | Jihperng Leu | 2005-01-25 |