Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977435 | Thick metal layer integrated process flow to improve power delivery and mechanical buffering | Sarah Kim, Bob Martell, Dave Ayers, Peter K. Moon, Steven Towle | 2005-12-20 |
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof | Scot Kellar, Sarah Kim | 2005-12-13 |
| 6908565 | Etch thinning techniques for wafer-to-wafer vertical stacks | Sarah Kim | 2005-06-21 |
| 6897125 | Methods of forming backside connections on a wafer stack | Patrick Morrow, Sarah Kim | 2005-05-24 |
| 6887769 | Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same | Scot Kellar, Sarah Kim | 2005-05-03 |
| 6870270 | Method and structure for interfacing electronic devices | Mauro J. Kobrinsky, Sarah Kim, Michael C. Harmes | 2005-03-22 |
| 6861274 | Method of making a SDI electroosmotic pump using nanoporous dielectric frit | Alan M. Myers, Quat Vu | 2005-03-01 |