Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof | Sarah Kim, R. Scott List | 2005-12-13 |
| 6911373 | Ultra-high capacitance device based on nanostructures | Sarah Kim | 2005-06-28 |
| 6887769 | Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same | Sarah Kim, R. Scott List | 2005-05-03 |