Issued Patents 2005
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977435 | Thick metal layer integrated process flow to improve power delivery and mechanical buffering | Bob Martell, Dave Ayers, R. Scott List, Peter K. Moon, Steven Towle | 2005-12-20 |
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof | Scot Kellar, R. Scott List | 2005-12-13 |
| 6943440 | Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow | Kevin J. Lee, Steven Towle | 2005-09-13 |
| 6914002 | Differential planarization | James A. Boardman, Paul B. Fischer, Mauro J. Kobrinsky | 2005-07-05 |
| 6911373 | Ultra-high capacitance device based on nanostructures | Scot Kellar | 2005-06-28 |
| 6908565 | Etch thinning techniques for wafer-to-wafer vertical stacks | R. Scott List | 2005-06-21 |
| 6897125 | Methods of forming backside connections on a wafer stack | Patrick Morrow, R. Scott List | 2005-05-24 |
| 6887769 | Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same | Scot Kellar, R. Scott List | 2005-05-03 |
| 6870270 | Method and structure for interfacing electronic devices | Mauro J. Kobrinsky, R. Scott List, Michael C. Harmes | 2005-03-22 |