Issued Patents 2005
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977435 | Thick metal layer integrated process flow to improve power delivery and mechanical buffering | Sarah Kim, Bob Martell, Dave Ayers, R. Scott List, Peter K. Moon | 2005-12-20 |
| 6975017 | Healing of micro-cracks in an on-chip dielectric | Anna George | 2005-12-13 |
| 6943440 | Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow | Sarah Kim, Kevin J. Lee | 2005-09-13 |
| 6927496 | Wafer-level thick film standing-wave clocking | Henning Braunisch | 2005-08-09 |
| 6894399 | Microelectronic device having signal distribution functionality on an interfacial layer thereof | Quat Vu, Tuy T. Ton | 2005-05-17 |
| 6888240 | High performance, low cost microelectronic circuit package with interposer | John Tang, Gilroy Vandentop | 2005-05-03 |
| 6846737 | Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials | Ebrahim Andideh, Lawrence Wong | 2005-01-25 |
| 6841413 | Thinned die integrated circuit package | Cheng-Yi Liu, Johanna M. Swan | 2005-01-11 |
| 6838299 | Forming defect prevention trenches in dicing streets | Rose Mulligan, Jun He, Thomas Marieb, Susanne Menezes | 2005-01-04 |