Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6908845 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Ravi Mahajan, Bala Natarajan | 2005-06-21 |
| 6848177 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Bala Natarajan, Chien Chiang, Greg Atwood, Valluri Rao | 2005-02-01 |
| 6841413 | Thinned die integrated circuit package | Cheng-Yi Liu, Steven Towle | 2005-01-11 |