Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6848177 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Johanna M. Swan, Bala Natarajan, Chien Chiang, Valluri Rao | 2005-02-01 |