Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964889 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Xiao-Chun Mu | 2005-11-15 |
| 6902950 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Xiao-Chun Mu | 2005-06-07 |
| 6894399 | Microelectronic device having signal distribution functionality on an interfacial layer thereof | Tuy T. Ton, Steven Towle | 2005-05-17 |
| 6861274 | Method of making a SDI electroosmotic pump using nanoporous dielectric frit | R. Scott List, Alan M. Myers | 2005-03-01 |