Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964889 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Quat Vu | 2005-11-15 |
| 6960479 | Stacked ferroelectric memory device and method of making same | Jian Li | 2005-11-01 |
| 6952017 | Low-voltage and interface damage-free polymer memory device | Jian Li, Mark Isenberger | 2005-10-04 |
| 6902950 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Quat Vu | 2005-06-07 |
| 6858862 | Discrete polymer memory array and method of making same | Jian Li | 2005-02-22 |