Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927180 | Reducing line to line capacitance using oriented dielectric films | David H. Gracias | 2005-08-09 |
| 6908829 | Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines | Makarem A. Hussein, Peter K. Moon, Jim Powers | 2005-06-21 |
| 6908863 | Sacrificial dielectric planarization layer | Chris Barns, Anne Miller | 2005-06-21 |
| 6872654 | Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric | Tian-An Chen | 2005-03-29 |