Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6899960 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Song Shi, Lejun Wang | 2005-05-31 |
| 6872654 | Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric | Kevin P. O'Brien | 2005-03-29 |