Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6940053 | Chip bonding heater with differential heat transfer | — | 2005-09-06 |
| 6902954 | Temperature sustaining flip chip assembly process | — | 2005-06-07 |
| 6899960 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Lejun Wang, Tian-An Chen | 2005-05-31 |