Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6908863 | Sacrificial dielectric planarization layer | Chris Barns, Kevin P. O'Brien | 2005-06-21 |
| 6909193 | High pH slurry for chemical mechanical polishing of copper | A. Feller, Kenneth Cadien | 2005-06-21 |
| 6852631 | Copper polish slurry for reduced interlayer dielectric erosion and method of using same | — | 2005-02-08 |
| 6838383 | Copper polish slurry for reduced interlayer dielectric erosion and method of using same | — | 2005-01-04 |