Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2005-11-22 |
| 6891233 | Methods to form dual metal gates by incorporating metals and their conductive oxides | Wenhe Lin, Kin Leong Pey, Simon Chooi | 2005-05-10 |
| 6875285 | System and method for dampening high pressure impact on porous materials | Ching-Ya Wang, Ping Chuang, Yu-Liang Lin, Henry Lo | 2005-04-05 |
| 6846899 | Poly(arylene ether) dielectrics | Christopher Lim, Siu Choon Ng, Hardy Chan, Simon Chooi | 2005-01-25 |
| 6841441 | Method to produce dual gates (one metal and one poly or metal silicide) for CMOS devices using sputtered metal deposition, metallic ion implantation, or silicon implantation, and laser annealing | Chew Hoe Ang, Eng Hua Lim, Randall Cher Liang Cha, Jia Zhen Zheng, Elgin Quek +1 more | 2005-01-11 |